Location: Hillsboro, OR
Company: Intel
packaging capability over the next decade we are putting together a dedicated team, tooling and FAB to drive wafer level assembly technology development (WATD) in the Ronler campus in Oregon. Intel WATD at Intel Hillsboro is a technology development organization to develop future generations of heterogenous integrated packaging process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities.
Seeking an experienced candidate to be the Process development Engineer in Dry etch or Deposition. Responsibilities include but are not limited to the following: Responsible for leading scientific research enabling manufacture of
innovative device architectures coupled with the realization of these architectures. Designing, executing, and analyzing experiments necessary to meet engineering specifications for their process.
Process development enabling manufacture of innovative advanced packaging products. Participate in development of intellectual property. Development of the equipment necessary to exploit the understanding gained in development in collaboration with equipment suppliers. Work effectively with the equipment supplier to identify shortcomings propose and evaluate hardware modification to mitigate issues. Operate manufacturing line in order to integrate the many individual steps necessary for the
manufacture of complex programs. Qualifications For information on Intel's immigration sponsorship guidelines, please see Intel U.
S. Immigration Sponsorship Information. You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences. Minimum Qualifications: Must possess a Bachelor's with 6+ years' experience , Master's with 4+ years' experience or Ph D with 2+ years' experience in Engineering, Materials science, Chemistry, Physics, or related field.
Must have 2+ years of direct Plasma related module engineering process/hardware technology development experience (Dry etch or Deposition). Preferred Qualifications: Have a strong working relationship with Area and Program-level decision-makers in Yield, Operation, and across Functional Areas, and is recognized as an expert. Leads or represents the Module or Area at one or more forums, such as Task Forces, integrated focus teams, Program meetings, Working Groups, Operation focus team, defect reduction team, Focus Teams, etc.
Highly self-sufficient, seeking only high-level context from manager. Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, interaction, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, interactionual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Working Model This role will require an on-site presence. Requisition #: JR0253365pca3lyuhf
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